High Performance Integrity : Next Gen High bandwidth/High Power/Low Voltage. Advanced Silicon/Package/PCB Interconnection design
Next-generation High performance chip/PKG/PCB 설계
3D EM Modeling
Designcon 2026 자료 리뷰 : SI/PI Thermal 관련
Next Generation 2.5D Advanced Package keynote :
2026년 반도체 시뮬레이션 최신 동향 :
