07NH Venture Investment and BNK Venture Investment raise Series A funding
04Selection as a Joint Research Institution for the Government Project on AI Semiconductor Chiplet-Based Interface Technology, and Development of Chiplet Design Simulator Technology
04Selection as Lead Institution for Government Project on Advanced Packaging (Jointly with KAIST and KETI), and Development of Advanced Packaging SI/PI Analysis Simulator
04Selection as Joint Research Institution for Government Project on 6G Network Technology Development, and Development of 6G SI Simulator Technology
06ACVS-AMI Release
05ACVS Sign-off solution contract (SK Hynix)
10ACVS Tech. Partner contract
10ACVS development and setup contract (SK Hynix)
08Open snpview.com
10Huwin-GSI development and setup contract (Samsung Electronics)
01Start ANSYS SI/PI simulation Training
12Huwin-D CAE Automation Tool development and setup contract (LG Electronics)
08ANSYS Participation Agreement contract
07Venture company certification
02Start R&D depart
12Distributor contract with EMCoS
05EPSI by Dr. Eric Bogatin
10Start SI/PI/EMI/EMC basic training
06Start Huwin Co., Ltd.