07Secured Series A funding from NH Venture Investment and BNK Venture Capital
04Selected as a joint research institution for a government R&D project on chiplet-based interface technology for AI semiconductors, developing a chiplet design simulator
04Selected as the lead company for a government advanced packaging R&D project (with KAIST and KETI), developing an SI/PI analysis simulator for advanced packaging
04Selected as a joint research institution for a government 6G network technology R&D project, developing a 6G SI simulator
06ACVS-AMI Release
05ACVS Sign-off solution contract (SK Hynix)
10ACVS Tech. Partner contract
10ACVS development and setup contract (SK Hynix)
08Open snpview.com
10Huwin-GSI development and setup contract (Samsung Electronics)
01Start ANSYS SI/PI simulation Training
12Huwin-D CAE Automation Tool development and setup contract (LG Electronics)
08ANSYS Participation Agreement contract
07Venture company certification
02Start R&D depart
12Distributor contract with EMCoS
05EPSI by Dr. Eric Bogatin
10Start SI/PI/EMI/EMC basic training
06Start Huwin Co., Ltd.